Custom fabricated to customer drawings utilizing high-temperature CNC laser drilling, edge chamfering, and chemical mechanical polishing (CMP).
In high-precision manufacturing environments—spanning sub-micron semiconductor photolithography, plasma-assisted chemical vapor deposition (PECVD), and excimer laser metrology—selecting the correct quartz glass disc substrate is critical. As China's leading quartz disc exporter located in Donghai County (the world-renowned crystal and quartz processing hub of Jiangsu), Zunex Quartz categorizes fused quartz and synthetic fused silica into three foundational grades governed by their molecular purity, hydroxyl content ([OH⁻]), and spectral transmission limits.
| Quartz Grade | Material Class | Wavelength Range | [OH⁻] Content | Primary Industrial Use-Cases |
|---|---|---|---|---|
| JGS1 | Synthetic Fused Silica | 185 nm – 2500 nm (Deep UV) | < 5 ppm to < 20 ppm | Laser optics, UV lithography masks, wafer sight windows, high-precision spectrometry |
| JGS2 | Fused Natural Quartz | 220 nm – 2500 nm (UV-Vis) | < 30 ppm | High-temperature viewports, plasma etch chamber discs, furnace diffusion carriers |
| JGS3 | Infrared Fused Quartz | 260 nm – 3500 nm (IR Grade) | < 5 ppm (Water-Free) | Infrared Pyrometry, CO₂ laser output mirrors, military aerospace thermography |
Thermal and Mechanical Resilience: Fused quartz displays a microscopic coefficient of thermal expansion (CTE) of approximately 5.5 × 10⁻⁷ /°C from 20°C to 320°C. This near-zero expansion enables our precision-ground quartz discs to endure intense thermal shock, surviving direct transitions from 1100°C continuous operating temperatures into ambient ice water without micro-fracturing or volumetric distortion. With an annealing point of 1215°C and softening point near 1683°C, our products represent the benchmark in thermal confinement.
Global semiconductor fabrication lines demand larger, ultra-flat quartz wafer carriers and erosion rings. Procurement trends demonstrate rapid migration toward 300mm+ single-piece fused silica discs finished with sub-nanometer surface roughness (Ra < 0.5 nm).
In chlorine and fluorine dry-etching chambers, standard quartz glass experiences accelerated lattice erosion. Modern procurement prioritizes custom CVD/PVD coated quartz rings and frosted discs that prevent wafer contamination and triple component service life.
Traditional diamond milling creates micro-cracks along the perimeter of quartz discs, causing thermal cleavage at high vacuum pressures. Next-gen quartz procurement mandates ultra-fast picosecond/femtosecond laser cutting, slotting, and step-edge micro-drilling.
Based directly in Donghai County, Zunex Quartz combines integrated raw material processing with precision CNC downstream finishing. As an audited manufacturer and exporter with verified annual revenues of US$2.5M to US$5.0M, we offer global procurement teams engineering accountability and rapid prototype-to-batch scalability.
Every drawing (PDF, DWG, DXF, STEP) undergoes rigorous DFM (Design for Manufacturability) analysis by our senior quartz engineers, preventing dimensional disputes and thermal stress failures prior to cutting.
Equipped with computerized high-power laser drilling and beveling stations, we produce multi-hole discs, vacuum bypass ports, sample carriers, and wafer carriers with dimensional tolerances held tightly within ±0.02 mm.
Fragile optical discs and heavy CVD furnace components are secured with custom high-density molded shock-proof EVA foam, sealed in multi-layer vacuum envelopes, and crated in fumigated export-grade plywood.
Addressing structural, chemical, and international logistical queries regarding custom quartz disc manufacturing.